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CADENCE DESIGN FOR MANUFACTURING
Cadence design for manufacturing (DFM) technologies enable you to verify and optimize layouts in digital and custom IC designs, while providing a reliable way to achieve manufacturing sign-off before tape-out.
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CADENCE SYSTEM-IN-PACKAGE DESIGN
Cadence system-in-package (SiP) design technology provides automation, integration, reliability and repeatability for system-level co-design, advanced packaging, and RF module design.
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Allegro System Interconnect Design Platform
The Cadence Allegro system interconnect design platform reduces costs and accelerates time to market by enabling a constraint-driven collaborative design across IC, package, and PCB domains.
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VIRTUOSO CUSTOM DESIGN PLATFORM
Silicon that's right, on time. The Virtuoso® platform enables the world's fastest, most silicon-accurate analog, custom digital, RF, and mixed-signal design. Today's advanced custom design teams are tackling designs on an order of magnitude more complex than just a few years ago. They must do so while addressing a growing number of physical effects in the package, power grid, interconnect, devices, and substrate. However, the design teams efficiency and effectiveness have been fundamentally limited by inadequate design environments.
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ENCOUNTER DIGITAL IC DESIGN PLATFORM
The Cadence Encounter platform is an integrated RTL-to-GDSII flow for complex and low power designs at 90nm and below. The Encounter® digital IC design platform includes a full spectrum of technologies for nanometer-scale digital design. These advanced capabilities include synthesis, test, formal verification, physical prototyping, signal integrity and timing, routing, constraint management, yield, power, and more.
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